The secret behind the slimness of the iPhone Air revealed |
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The new iPhone Air is only 5.6 mm thick, making it one of the thinnest smartphones ever. To achieve this, Apple had to radically redesign the internal layout. Images of the motherboard that have emerged give a better idea of how everything is arranged inside. At first glance, it seemed that Apple had managed to fit all the “guts” right into the massive camera block. However, the motherboard diagrams show that only part of the electronics are located in the protrusion, with the rest placed next to the battery. The schematics and board markings were published by insider ShrimpApplePro. To save space, engineers used a “sandwich design” where components are located on both sides of the board, including the A19 Pro processor, C1X modem, and N1 wireless chip developed by Apple. An illustration published by user @BasQuxFoo clearly shows that only the section with the A19 Pro processor is located inside the protrusion, while the rest of the motherboard extends into the device's body. It is believed that this solution could be a step towards even more compact designs. In the future, if Apple manages to reduce the size of the board, we can expect the entire board to be located in the camera block, with the freed-up space being taken up by a larger battery. |
